0 Καλάθι
Εγγραφή Σύνδεση
0 Καλάθι
Εγγραφή Σύνδεση
  • Αρχική σελίδα /
  • Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
Εικόνα της Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the abovementioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
Γίνε ο πρώτος που θα αξιολόγησει αυτό το προϊόν
ΚΩΔΙΚΟΣ ΠΡΟΪΟΝΤΟΣ: CYS EN IEC 60286-3:2019
€84.00
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the abovementioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).