Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.
SKU: CYS EN IEC 61189-2-804:2023
€30.00
This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.