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  • Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

This International Standard specifies a test method to determine the Z-Axis Expansion of base materials and printed boards using a thermomechanical analyser (TMA).
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ΚΩΔΙΚΟΣ ΠΡΟΪΟΝΤΟΣ: CYS EN IEC 61189-2-803:2023
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This International Standard specifies a test method to determine the Z-Axis Expansion of base materials and printed boards using a thermomechanical analyser (TMA).